Defense TechConnect selects VIA for poster presentation at upcoming conference in Austin, TX

Another trip to Austin, Texas, to discuss cutting-edge solutions for the DoD’s most pressing challenges!

VIA’s Chief Commercial Officer, Joe Babiec, is heading to the Defense TechConnect Innovation Summit & Expo on December 3-5, 2024. VIA was selected for a December 3 poster presentation about SLAM AI, our ultra-secure GenAI architecture for natural language analysis and visualization of sensitive data.

To learn more about the event, attended by top military, industry, and investment leadership dedicated to national security-related innovation and societal advancement, visit the event website and follow us on LinkedIn and X for photos and insights.